INTEL AF82801IBM PDF

Find great deals for 1x Intel AFIBM BGA Chipset With Lead Solder Balls. Shop with confidence on eBay!. Model Number: AFIBM SLB8Q. Date Code: 1 PCS intel AFIBM SLB8Q BGA Chipset with solder balls. 1 PCS intel . AFIBM. BGA: CHIP. AFIBM S LB8Q Specifications: Manufacturer: Intel ; Product: Mobile Chipsets ; Operating Supply Voltage: V, V, V, 5 V ; Maximum Operating.

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Read more about the condition. Before buying, you should consider 3 points: See the seller’s listing for full details. Search examples You can search our catalog of processors, chipsets, kits, SSDs, server products and more in several ways.

10X NEW Intel AF82801IBM BGA Chipset With Lead free Solder Balls

Read more about the condition. Learn More – opens in a new window or tab International shipping and import charges paid to Pitney Bowes Inc. Clear queue Compare 0. Support Home Product Specifications Chipsets. USB Universal Serial Bus is an industry standard connection technology for attaching peripheral devices to a computer. Please refer to the Launch Date for market availability.

Please enter a number less than or equal to Visit eBay’s page on international trade. Add to watch list Remove from watch list. For additional information, see the Global Shipping Program terms and conditions – opens in a new window or tab. Packaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in non-retail packaging, such as an ingel box or plastic bag.

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10X NEW Intel AFIBM BGA Chip Chipset With Solder Balls US Seller | eBay

What is the difference between Boxed and Tray Processors? Intek BGA chips you buy from our company are of high technology and as precise as nanometer. For additional information, see the Global Shipping Program terms and conditions – opens in a new window or tab This amount includes applicable customs duties, taxes, brokerage and other fees.

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Dear Buyers, Please pay attention to the following instruction upon receipt our chips.

Core i7 Product Number: It enables an environment where applications can run ingel their own space, protected from all other software on the system. Holidays or weather may effect timeline. Back to home page Return to top.

Learn More – opens in a new window or tab International shipping and import charges paid to Af8280ibm Bowes Inc. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.

1x Intel AF82801IBM BGA Chipset With Lead Solder Balls

Select a valid country. As BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control, or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering. Listing of RCP does not constitute a formal pricing offer from Intel.